MULTICHIP MODULE WITH STIFFING FRAME AND ASSOCIATED COVERS

A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SIKKA KAMAL K, MONJEAU GREGG B, TOY HILTON T, WEISS THOMAS, LI SHIDONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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