Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and NiPt Residues

Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and NiPt Residues

A method for cleaning residues from a semiconductor substrate during a nickel platinum silicidation process is disclosed, including a multi-step residue cleaning, including exposing the substrate to an aqua regia solution, followed by an exposure to a solution having hydrochloric acid and hydrogen p...

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Hauptverfasser: KARLSSON OLOV, FITZ CLEMENS, DUONG ANH
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator KARLSSON OLOV
FITZ CLEMENS
DUONG ANH
description A method for cleaning residues from a semiconductor substrate during a nickel platinum silicidation process is disclosed, including a multi-step residue cleaning, including exposing the substrate to an aqua regia solution, followed by an exposure to a solution having hydrochloric acid and hydrogen peroxide. The SC2 solution can further react with remaining platinum residues, rendering it more soluble in an aqueous solution and thereby dissolving it from the surface of the substrate.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2014363944A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2014363944A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2014363944A13</originalsourceid><addsrcrecordid>eNrjZPB3LCxNVAhKTc9MVEjMS1HwqEwpyk9PzVMISC3Kr8hMSVXwcM5RcM7PTcrMSyzJzM9TKMkHKs_NL0tV8MsEa_HLDCgBChVnppSmFvMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDQxNjM2NLExNHQ2PiVAEAU2A2OQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and NiPt Residues</title><source>esp@cenet</source><creator>KARLSSON OLOV ; FITZ CLEMENS ; DUONG ANH</creator><creatorcontrib>KARLSSON OLOV ; FITZ CLEMENS ; DUONG ANH</creatorcontrib><description>A method for cleaning residues from a semiconductor substrate during a nickel platinum silicidation process is disclosed, including a multi-step residue cleaning, including exposing the substrate to an aqua regia solution, followed by an exposure to a solution having hydrochloric acid and hydrogen peroxide. The SC2 solution can further react with remaining platinum residues, rendering it more soluble in an aqueous solution and thereby dissolving it from the surface of the substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20141211&amp;DB=EPODOC&amp;CC=US&amp;NR=2014363944A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20141211&amp;DB=EPODOC&amp;CC=US&amp;NR=2014363944A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KARLSSON OLOV</creatorcontrib><creatorcontrib>FITZ CLEMENS</creatorcontrib><creatorcontrib>DUONG ANH</creatorcontrib><title>Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and NiPt Residues</title><description>A method for cleaning residues from a semiconductor substrate during a nickel platinum silicidation process is disclosed, including a multi-step residue cleaning, including exposing the substrate to an aqua regia solution, followed by an exposure to a solution having hydrochloric acid and hydrogen peroxide. The SC2 solution can further react with remaining platinum residues, rendering it more soluble in an aqueous solution and thereby dissolving it from the surface of the substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB3LCxNVAhKTc9MVEjMS1HwqEwpyk9PzVMISC3Kr8hMSVXwcM5RcM7PTcrMSyzJzM9TKMkHKs_NL0tV8MsEa_HLDCgBChVnppSmFvMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDQxNjM2NLExNHQ2PiVAEAU2A2OQ</recordid><startdate>20141211</startdate><enddate>20141211</enddate><creator>KARLSSON OLOV</creator><creator>FITZ CLEMENS</creator><creator>DUONG ANH</creator><scope>EVB</scope></search><sort><creationdate>20141211</creationdate><title>Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and NiPt Residues</title><author>KARLSSON OLOV ; FITZ CLEMENS ; DUONG ANH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014363944A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KARLSSON OLOV</creatorcontrib><creatorcontrib>FITZ CLEMENS</creatorcontrib><creatorcontrib>DUONG ANH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KARLSSON OLOV</au><au>FITZ CLEMENS</au><au>DUONG ANH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and NiPt Residues</title><date>2014-12-11</date><risdate>2014</risdate><abstract>A method for cleaning residues from a semiconductor substrate during a nickel platinum silicidation process is disclosed, including a multi-step residue cleaning, including exposing the substrate to an aqua regia solution, followed by an exposure to a solution having hydrochloric acid and hydrogen peroxide. The SC2 solution can further react with remaining platinum residues, rendering it more soluble in an aqueous solution and thereby dissolving it from the surface of the substrate.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and NiPt Residues
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T14%3A07%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KARLSSON%20OLOV&rft.date=2014-12-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2014363944A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true