SEMICONDUCTOR PACKAGE STACK HAVING A HEAT SLUG

A semiconductor package stack, comprising: a lower semiconductor package including a lower semiconductor chip mounted on a lower package board; an upper semiconductor package stacked on the lower semiconductor package and including an upper semiconductor chip mounted on an upper package board, where...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM YONG-HOON, KIM JIUL, CHOI IN-HO, SHIN SEONG-HO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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