Method for Mounting a Semiconductor Chip on a Carrier

A method includes providing a semiconductor chip having a first main surface and a layer of solder material deposited on the first main surface, wherein the layer of solder material has a roughness of at least 1 μm. The semiconductor chip is placed on a carrier with the first main surface of the sem...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ROESL KONRAD, EICHINGER OLIVER, HEINRICH ALEXANDER
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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