ON-DEVICE METROLOGY

Methods and systems for performing semiconductor metrology directly on device structures are presented. A measurement model is created based on measured training data collected from at least one device structure. The trained measurement model is used to calculate process parameter values, structure...

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Hauptverfasser: SHCHEGROV ANDREI V, MADSEN JONATHAN M, LEVY ADY, TADMOR ORI, PANDEV STILIAN IVANOV, KANDEL DANIEL, ADEL MICHAEL E
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creator SHCHEGROV ANDREI V
MADSEN JONATHAN M
LEVY ADY
TADMOR ORI
PANDEV STILIAN IVANOV
KANDEL DANIEL
ADEL MICHAEL E
description Methods and systems for performing semiconductor metrology directly on device structures are presented. A measurement model is created based on measured training data collected from at least one device structure. The trained measurement model is used to calculate process parameter values, structure parameter values, or both, directly from measurement data collected from device structures of other wafers. In some examples, measurement data from multiple targets is collected for model building, training, and measurement. In some examples, the use of measurement data associated with multiple targets eliminates, or significantly reduces, the effect of under layers in the measurement result, and enables more accurate measurements. Measurement data collected for model building, training, and measurement may be derived from measurements performed by a combination of multiple, different measurement techniques.
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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ON-DEVICE METROLOGY
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