SEMICONDUCTOR PACKAGE HAVING IC DICE AND VOLTAGE TUNERS

A semiconductor package includes an interposer and a plurality of integrated circuit (IC) dice disposed on and intercoupled via the interposer. A first IC die has a clock speed rating that is greater than a clock speed rating of another of the IC dice. A plurality of programmable voltage tuners are...

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Bibliographische Detailangaben
Hauptverfasser: GAN ANDY H, LI XIAO-YU, VO THAO H.T, KLEIN MATTHEW H
Format: Patent
Sprache:eng
Schlagworte:
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