METHOD OF FABRICATING MEMS DEVICE HAVING RELEASE ETCH STOP LAYER

A method of fabricating a microelectromechanical (MEMS) device includes bonding a transducer wafer to a substrate wafer along a bond interface. An unpatterned transducer layer included within the transducer wafer is patterned. A release etch process is then performed during which a sacrificial layer...

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1. Verfasser: LAGOUGE MATTHIEU
Format: Patent
Sprache:eng
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