SUBSTRATE PRECESSION MECHANISM FOR CMP POLISHING HEAD
A substrate precession apparatus for a carrier head is provided. The apparatus enables substrate precession, which is the rotational movement of the substrate relative to the carrier head during polishing of the substrate. The carrier head and a retaining ring assembly may be de-coupled and move ind...
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| creator | CHEN CHIH HUNG HSU SAMUEL CHUIANG GURUSAMY JAYAKUMAR DANDAVATE GAUTAM SHASHANK |
| description | A substrate precession apparatus for a carrier head is provided. The apparatus enables substrate precession, which is the rotational movement of the substrate relative to the carrier head during polishing of the substrate. The carrier head and a retaining ring assembly may be de-coupled and move independently of one another to promote substrate precession during a CMP process. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2014273756A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2014273756A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2014273756A13</originalsourceid><addsrcrecordid>eNrjZDANDnUKDglyDHFVCAhydXYNDvb091PwdXX2cPTzDPZVcPMPUnD2DVAI8PfxDPbw9HNX8HB1dOFhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhiZG5sbmpmaOhsbEqQIAm_sorQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE PRECESSION MECHANISM FOR CMP POLISHING HEAD</title><source>esp@cenet</source><creator>CHEN CHIH HUNG ; HSU SAMUEL CHUIANG ; GURUSAMY JAYAKUMAR ; DANDAVATE GAUTAM SHASHANK</creator><creatorcontrib>CHEN CHIH HUNG ; HSU SAMUEL CHUIANG ; GURUSAMY JAYAKUMAR ; DANDAVATE GAUTAM SHASHANK</creatorcontrib><description>A substrate precession apparatus for a carrier head is provided. The apparatus enables substrate precession, which is the rotational movement of the substrate relative to the carrier head during polishing of the substrate. The carrier head and a retaining ring assembly may be de-coupled and move independently of one another to promote substrate precession during a CMP process.</description><language>eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140918&DB=EPODOC&CC=US&NR=2014273756A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140918&DB=EPODOC&CC=US&NR=2014273756A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN CHIH HUNG</creatorcontrib><creatorcontrib>HSU SAMUEL CHUIANG</creatorcontrib><creatorcontrib>GURUSAMY JAYAKUMAR</creatorcontrib><creatorcontrib>DANDAVATE GAUTAM SHASHANK</creatorcontrib><title>SUBSTRATE PRECESSION MECHANISM FOR CMP POLISHING HEAD</title><description>A substrate precession apparatus for a carrier head is provided. The apparatus enables substrate precession, which is the rotational movement of the substrate relative to the carrier head during polishing of the substrate. The carrier head and a retaining ring assembly may be de-coupled and move independently of one another to promote substrate precession during a CMP process.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDANDnUKDglyDHFVCAhydXYNDvb091PwdXX2cPTzDPZVcPMPUnD2DVAI8PfxDPbw9HNX8HB1dOFhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhiZG5sbmpmaOhsbEqQIAm_sorQ</recordid><startdate>20140918</startdate><enddate>20140918</enddate><creator>CHEN CHIH HUNG</creator><creator>HSU SAMUEL CHUIANG</creator><creator>GURUSAMY JAYAKUMAR</creator><creator>DANDAVATE GAUTAM SHASHANK</creator><scope>EVB</scope></search><sort><creationdate>20140918</creationdate><title>SUBSTRATE PRECESSION MECHANISM FOR CMP POLISHING HEAD</title><author>CHEN CHIH HUNG ; HSU SAMUEL CHUIANG ; GURUSAMY JAYAKUMAR ; DANDAVATE GAUTAM SHASHANK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014273756A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN CHIH HUNG</creatorcontrib><creatorcontrib>HSU SAMUEL CHUIANG</creatorcontrib><creatorcontrib>GURUSAMY JAYAKUMAR</creatorcontrib><creatorcontrib>DANDAVATE GAUTAM SHASHANK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN CHIH HUNG</au><au>HSU SAMUEL CHUIANG</au><au>GURUSAMY JAYAKUMAR</au><au>DANDAVATE GAUTAM SHASHANK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PRECESSION MECHANISM FOR CMP POLISHING HEAD</title><date>2014-09-18</date><risdate>2014</risdate><abstract>A substrate precession apparatus for a carrier head is provided. The apparatus enables substrate precession, which is the rotational movement of the substrate relative to the carrier head during polishing of the substrate. The carrier head and a retaining ring assembly may be de-coupled and move independently of one another to promote substrate precession during a CMP process.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
| title | SUBSTRATE PRECESSION MECHANISM FOR CMP POLISHING HEAD |
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