Flexible Metal Interconnect Structure

A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-ap...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHOW EUGENE M, DEBRUYKER DIRK
Format: Patent
Sprache:eng
Schlagworte:
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