SYSTEM AND METHOD TO DETERMINE DEPTH FOR OPTICAL WAFER INSPECTION

A computer-based method for inspecting a wafer, including: storing, in a memory element for at least one computer, computer readable instructions; detecting a first light beam rotating in a first spiral about a first central axis; and executing, using a processor for the at least one computer, the c...

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Hauptverfasser: DANEN ROBERT, HAURYLAU MIKHAIL, KOLCHIN PAVEL
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creator DANEN ROBERT
HAURYLAU MIKHAIL
KOLCHIN PAVEL
description A computer-based method for inspecting a wafer, including: storing, in a memory element for at least one computer, computer readable instructions; detecting a first light beam rotating in a first spiral about a first central axis; and executing, using a processor for the at least one computer, the computer readable instructions to generate, using the detected first light beam, an image including at least one shape, determine an orientation of the at least one shape or a size of the at least one shape, and calculate a depth of a defect in the wafer according to the orientation or the size.
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subjects INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
TESTING
title SYSTEM AND METHOD TO DETERMINE DEPTH FOR OPTICAL WAFER INSPECTION
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