SEMICONDUCTOR WAFER, SEMICONDUCTOR PROCESS AND SEMICONDUCTOR PACKAGE

The present invention provides a semiconductor wafer, semiconductor package and semiconductor process. The semiconductor wafer includes a substrate, at least one metal segment and a plurality of dielectric layers. The semiconductor wafer is defined as a plurality of die areas and a plurality of tren...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WANG YUNG-HUI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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