METHODS AND APPARATUSES FOR DRYING ELECTRONIC DEVICES
Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with th...
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| creator | TRUSTY JOEL TRUSTY MICAH ZIELINSKI REUBEN |
| description | Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device. |
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Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device.</description><language>eng</language><subject>BLASTING ; DRYING ; DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; WEAPONS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140918&DB=EPODOC&CC=US&NR=2014259730A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140918&DB=EPODOC&CC=US&NR=2014259730A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TRUSTY JOEL</creatorcontrib><creatorcontrib>TRUSTY MICAH</creatorcontrib><creatorcontrib>ZIELINSKI REUBEN</creatorcontrib><title>METHODS AND APPARATUSES FOR DRYING ELECTRONIC DEVICES</title><description>Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device.</description><subject>BLASTING</subject><subject>DRYING</subject><subject>DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD1dQ3x8HcJVnD0c1FwDAhwDHIMCQ12DVZw8w9ScAmK9PRzV3D1cXUOCfL383RWcHEN83R2DeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhiZGppbmxgaOhsbEqQIAkD0ooQ</recordid><startdate>20140918</startdate><enddate>20140918</enddate><creator>TRUSTY JOEL</creator><creator>TRUSTY MICAH</creator><creator>ZIELINSKI REUBEN</creator><scope>EVB</scope></search><sort><creationdate>20140918</creationdate><title>METHODS AND APPARATUSES FOR DRYING ELECTRONIC DEVICES</title><author>TRUSTY JOEL ; TRUSTY MICAH ; ZIELINSKI REUBEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014259730A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BLASTING</topic><topic>DRYING</topic><topic>DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>TRUSTY JOEL</creatorcontrib><creatorcontrib>TRUSTY MICAH</creatorcontrib><creatorcontrib>ZIELINSKI REUBEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TRUSTY JOEL</au><au>TRUSTY MICAH</au><au>ZIELINSKI REUBEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHODS AND APPARATUSES FOR DRYING ELECTRONIC DEVICES</title><date>2014-09-18</date><risdate>2014</risdate><abstract>Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BLASTING DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM HEATING LIGHTING MECHANICAL ENGINEERING WEAPONS |
| title | METHODS AND APPARATUSES FOR DRYING ELECTRONIC DEVICES |
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