LED BACK END ASSEMBLY AND METHOD OF MANUFACTURING

An LED device and method of manufacture including separately coupling a thin flexible interposer and an LED die to a heat sink structure and then electrically coupling the interposer and the LED die together with a wirebond. A specifically shaped perimeter of an aperture within the interposer negate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KURWA MURAD, PANG TAK SHING DICK, TAM SAMUEL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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