FLEXIBLE POWERED CARDS AND DEVICES, AND METHODS OF MANUFACTURING FLEXIBLE POWERED CARDS AND DEVICES

FLEXIBLE POWERED CARDS AND DEVICES, AND METHODS OF MANUFACTURING FLEXIBLE POWERED CARDS AND DEVICES

A flexible device, such as a powered card or processor based system, may include a flexible assembly. The flexible assembly may include a die adhered to a flexible substrate (e.g., a PCB) by a flexible adhesive. The die may be stacked with other dies that may be adhered to each other with a flexible...

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1. Verfasser: O'SHEA NORMAN E
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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description A flexible device, such as a powered card or processor based system, may include a flexible assembly. The flexible assembly may include a die adhered to a flexible substrate (e.g., a PCB) by a flexible adhesive. The die may be stacked with other dies that may be adhered to each other with a flexible adhesive. A conductive pad may be between a flexible substrate and a flexible adhesive. Bond wires may interconnect one or more dies and the flexible substrate via bond pads. In a stacked die configuration, the dies may be thinned using a thinning and/or a polishing process. Such thinned dies may be flexible. The flexible assembly may be flexibly encapsulated.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title FLEXIBLE POWERED CARDS AND DEVICES, AND METHODS OF MANUFACTURING FLEXIBLE POWERED CARDS AND DEVICES
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