SEMICONDUCTOR GRID ARRAY PACKAGE

A semiconductor grid array package has a first housing member with a cavity that has a cavity floor and cavity walls. A semiconductor die is affixed to the cavity floor. A second housing member is molded to the first housing member and covers an interface surface of the die. Electrically conductive...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIM FUI YEE, YAP WENG FOONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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