Electronic Packages and Components Thereof Formed by Co-Deposited Carbon Nanotubes
Microelectronic packages may be formed using the co-deposition of carbon nanotubes. The carbon nanotubes may be functionalized to have an appropriate charge so they can be combined with other materials to give suitable properties. The other materials that are co-deposited may include metals, ceramic...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | WAKHARKAR VIJAY S RARAVIKAR NACHIKET R |
| description | Microelectronic packages may be formed using the co-deposition of carbon nanotubes. The carbon nanotubes may be functionalized to have an appropriate charge so they can be combined with other materials to give suitable properties. The other materials that are co-deposited may include metals, ceramics, and polymers. The electronic package components may be formed including thermal interface materials, vias, trenches, capacitors, memories, substrates, and substrate cores, as a few examples. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2014231265A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2014231265A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2014231265A13</originalsourceid><addsrcrecordid>eNqNi7EKwjAURbs4iPoPD5wLJlV3iS1OIlrn8pq-arF9LyRx8O_N4Ac4XQ7n3Hl2LUey0QsPFi5oX_igAMgdGJmcMHEMUD_Jk_RQiZ-og_aTZH4kJ2GIiQ36VhjOyBLfLYVlNutxDLT67SJbV2VtTnl6NBQcWmKKzf2mN2qrC6X3u4Mq_qu-oIM4Sg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic Packages and Components Thereof Formed by Co-Deposited Carbon Nanotubes</title><source>esp@cenet</source><creator>WAKHARKAR VIJAY S ; RARAVIKAR NACHIKET R</creator><creatorcontrib>WAKHARKAR VIJAY S ; RARAVIKAR NACHIKET R</creatorcontrib><description>Microelectronic packages may be formed using the co-deposition of carbon nanotubes. The carbon nanotubes may be functionalized to have an appropriate charge so they can be combined with other materials to give suitable properties. The other materials that are co-deposited may include metals, ceramics, and polymers. The electronic package components may be formed including thermal interface materials, vias, trenches, capacitors, memories, substrates, and substrate cores, as a few examples.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140821&DB=EPODOC&CC=US&NR=2014231265A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140821&DB=EPODOC&CC=US&NR=2014231265A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WAKHARKAR VIJAY S</creatorcontrib><creatorcontrib>RARAVIKAR NACHIKET R</creatorcontrib><title>Electronic Packages and Components Thereof Formed by Co-Deposited Carbon Nanotubes</title><description>Microelectronic packages may be formed using the co-deposition of carbon nanotubes. The carbon nanotubes may be functionalized to have an appropriate charge so they can be combined with other materials to give suitable properties. The other materials that are co-deposited may include metals, ceramics, and polymers. The electronic package components may be formed including thermal interface materials, vias, trenches, capacitors, memories, substrates, and substrate cores, as a few examples.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi7EKwjAURbs4iPoPD5wLJlV3iS1OIlrn8pq-arF9LyRx8O_N4Ac4XQ7n3Hl2LUey0QsPFi5oX_igAMgdGJmcMHEMUD_Jk_RQiZ-og_aTZH4kJ2GIiQ36VhjOyBLfLYVlNutxDLT67SJbV2VtTnl6NBQcWmKKzf2mN2qrC6X3u4Mq_qu-oIM4Sg</recordid><startdate>20140821</startdate><enddate>20140821</enddate><creator>WAKHARKAR VIJAY S</creator><creator>RARAVIKAR NACHIKET R</creator><scope>EVB</scope></search><sort><creationdate>20140821</creationdate><title>Electronic Packages and Components Thereof Formed by Co-Deposited Carbon Nanotubes</title><author>WAKHARKAR VIJAY S ; RARAVIKAR NACHIKET R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014231265A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>WAKHARKAR VIJAY S</creatorcontrib><creatorcontrib>RARAVIKAR NACHIKET R</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WAKHARKAR VIJAY S</au><au>RARAVIKAR NACHIKET R</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic Packages and Components Thereof Formed by Co-Deposited Carbon Nanotubes</title><date>2014-08-21</date><risdate>2014</risdate><abstract>Microelectronic packages may be formed using the co-deposition of carbon nanotubes. The carbon nanotubes may be functionalized to have an appropriate charge so they can be combined with other materials to give suitable properties. The other materials that are co-deposited may include metals, ceramics, and polymers. The electronic package components may be formed including thermal interface materials, vias, trenches, capacitors, memories, substrates, and substrate cores, as a few examples.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2014231265A1 |
| source | esp@cenet |
| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | Electronic Packages and Components Thereof Formed by Co-Deposited Carbon Nanotubes |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T09%3A23%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WAKHARKAR%20VIJAY%20S&rft.date=2014-08-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2014231265A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |