ADJUSTABLE CURRENT SHIELD FOR ELECTROPLATING PROCESSES

One illustrative plating apparatus disclosed herein includes a substrate holder that is adapted to receive a substrate, an anode and an adjustable current shield positioned between the substrate holder and the anode. In this illustrative embodiment, the adjustable current shield includes a stationar...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SCHROIFF CHRISTIAN, SANDMANN GUNTHER WILHELM, SIURY KERSTIN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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