WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE

WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE

A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side co...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HOANG ELIZABETH, DUTT GYANENDRA, RUATTA STEPHEN, ZHUO QIZHUO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator HOANG ELIZABETH
DUTT GYANENDRA
RUATTA STEPHEN
ZHUO QIZHUO
description A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2014225283A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2014225283A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2014225283A13</originalsourceid><addsrcrecordid>eNrjZNAPd3RzDVJwcnT2Vgj2dHFVcPZ3DPH0c1dwDFZw8XQGsUIcA1wVHF08XIM9w1x5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgaGJkZGpkYWxo6ExcaoAU30mSQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE</title><source>esp@cenet</source><creator>HOANG ELIZABETH ; DUTT GYANENDRA ; RUATTA STEPHEN ; ZHUO QIZHUO</creator><creatorcontrib>HOANG ELIZABETH ; DUTT GYANENDRA ; RUATTA STEPHEN ; ZHUO QIZHUO</creatorcontrib><description>A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140814&amp;DB=EPODOC&amp;CC=US&amp;NR=2014225283A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140814&amp;DB=EPODOC&amp;CC=US&amp;NR=2014225283A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOANG ELIZABETH</creatorcontrib><creatorcontrib>DUTT GYANENDRA</creatorcontrib><creatorcontrib>RUATTA STEPHEN</creatorcontrib><creatorcontrib>ZHUO QIZHUO</creatorcontrib><title>WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE</title><description>A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAPd3RzDVJwcnT2Vgj2dHFVcPZ3DPH0c1dwDFZw8XQGsUIcA1wVHF08XIM9w1x5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgaGJkZGpkYWxo6ExcaoAU30mSQ</recordid><startdate>20140814</startdate><enddate>20140814</enddate><creator>HOANG ELIZABETH</creator><creator>DUTT GYANENDRA</creator><creator>RUATTA STEPHEN</creator><creator>ZHUO QIZHUO</creator><scope>EVB</scope></search><sort><creationdate>20140814</creationdate><title>WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE</title><author>HOANG ELIZABETH ; DUTT GYANENDRA ; RUATTA STEPHEN ; ZHUO QIZHUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014225283A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HOANG ELIZABETH</creatorcontrib><creatorcontrib>DUTT GYANENDRA</creatorcontrib><creatorcontrib>RUATTA STEPHEN</creatorcontrib><creatorcontrib>ZHUO QIZHUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOANG ELIZABETH</au><au>DUTT GYANENDRA</au><au>RUATTA STEPHEN</au><au>ZHUO QIZHUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE</title><date>2014-08-14</date><risdate>2014</risdate><abstract>A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2014225283A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-01T16%3A25%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HOANG%20ELIZABETH&rft.date=2014-08-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2014225283A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true