TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS

Techniques and structure are disclosed for enhancing fracture resistance of back-end interconnects and other such interconnect structures by increasing via density. Increased via density can be provided, for example, within the filler/dummified portion(s) of adjacent circuit layers within a die. In...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BHINGARDE SIDDHARTH B, KOBRINSKY MAURO J, PANTUSO DANIEL, O'DAY MICHAEL P, JEZEWSKI CHRISTOPHER J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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