POWER ELECTRONICS INTERCONNECTION FOR ELECTRIC MOTOR DRIVES
The bus bar includes a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of the first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor...
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| creator | CHI WILLIAM T KALAYJIAN NICHOLAS R KUBBA MICHAEL R KROEZE RYAN C FERGUSON JOSHUA WILLARD DETTMANN BENJAMIN D |
| description | The bus bar includes a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of the first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of the first dielectric layer and the top surface of the first bus bar layer wherein: the first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of the electrical component and wherein: the first dielectric layer and the second bus bar layer each include a via aligned with the first via wherein the first electrical lead is extendable from beneath the first bus bar layer through the first dielectric layer and through the second bus bar layer. |
| format | Patent |
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a first dielectric layer overlying a top surface of the first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of the first dielectric layer and the top surface of the first bus bar layer wherein: the first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of the electrical component and wherein: the first dielectric layer and the second bus bar layer each include a via aligned with the first via wherein the first electrical lead is extendable from beneath the first bus bar layer through the first dielectric layer and through the second bus bar layer.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRICITY ; GENERATION ; INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES ; 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KALAYJIAN NICHOLAS R ; KUBBA MICHAEL R ; KROEZE RYAN C ; FERGUSON JOSHUA WILLARD ; DETTMANN BENJAMIN D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014209344A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES</topic><topic>INSULATORS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHI WILLIAM T</creatorcontrib><creatorcontrib>KALAYJIAN NICHOLAS R</creatorcontrib><creatorcontrib>KUBBA MICHAEL R</creatorcontrib><creatorcontrib>KROEZE RYAN C</creatorcontrib><creatorcontrib>FERGUSON JOSHUA WILLARD</creatorcontrib><creatorcontrib>DETTMANN BENJAMIN D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHI WILLIAM T</au><au>KALAYJIAN NICHOLAS R</au><au>KUBBA MICHAEL R</au><au>KROEZE RYAN C</au><au>FERGUSON JOSHUA WILLARD</au><au>DETTMANN BENJAMIN D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POWER ELECTRONICS INTERCONNECTION FOR ELECTRIC MOTOR DRIVES</title><date>2014-07-31</date><risdate>2014</risdate><abstract>The bus bar includes a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of the first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of the first dielectric layer and the top surface of the first bus bar layer wherein: the first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of the electrical component and wherein: the first dielectric layer and the second bus bar layer each include a via aligned with the first via wherein the first electrical lead is extendable from beneath the first bus bar layer through the first dielectric layer and through the second bus bar layer.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRICITY GENERATION INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| title | POWER ELECTRONICS INTERCONNECTION FOR ELECTRIC MOTOR DRIVES |
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