CHIP PACKAGE AND METHOD FOR FORMING THE SAME

According to an embodiment of the invention, a chip package is provided. The chip package includes: a substrate having an upper surface and a lower surface; a plurality of conducting pads located under the lower surface of the substrate; a dielectric layer located between the conducting pads; a tren...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU TSANG-YU, YEN YU-LIN, CHEN CHIEN-HUI, YEOU LONG-SHENG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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