SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS

An apparatus according to the invention may include one or more fuses placed on a printed circuit board on which an printed circuit board assembly is formed. Each fuse changes in response to ambient thermal conditions beyond a threshold temperature. The change can be detected with a testing apparatu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUGO STEPHEN MICHAEL, KELLY MATTHEW STEPHEN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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