METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH A SEMICONDUCTOR CHIP USED IN THE METHOD

METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH A SEMICONDUCTOR CHIP USED IN THE METHOD

A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary...

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Hauptverfasser: PARK SANG-SICK, SONG HO-GEON, UMEMOTO MITSUO, JEON CHANG-SEONG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator PARK SANG-SICK
SONG HO-GEON
UMEMOTO MITSUO
JEON CHANG-SEONG
description A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2014196280A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2014196280A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2014196280A13</originalsourceid><addsrcrecordid>eNqNjbEKwjAURbs4iPoPD5yFtoro-HhJmqBNQvIylyJxUbRQ_x8L9QNczl3O5SyLRytZOwFOQYs2KSROwdgGENTVeCA9wSNdsJGAVgB6jwE5RWAHyIykJzfK1pCzIhG7MJ9SlAKMBdYS5si6WNz755g3v10VWyWZ9C4P7y6PQ3_Lr_zpUqzL6lCdj_WpxGr_n_UFKrE2mA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH A SEMICONDUCTOR CHIP USED IN THE METHOD</title><source>esp@cenet</source><creator>PARK SANG-SICK ; SONG HO-GEON ; UMEMOTO MITSUO ; JEON CHANG-SEONG</creator><creatorcontrib>PARK SANG-SICK ; SONG HO-GEON ; UMEMOTO MITSUO ; JEON CHANG-SEONG</creatorcontrib><description>A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140717&amp;DB=EPODOC&amp;CC=US&amp;NR=2014196280A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140717&amp;DB=EPODOC&amp;CC=US&amp;NR=2014196280A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARK SANG-SICK</creatorcontrib><creatorcontrib>SONG HO-GEON</creatorcontrib><creatorcontrib>UMEMOTO MITSUO</creatorcontrib><creatorcontrib>JEON CHANG-SEONG</creatorcontrib><title>METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH A SEMICONDUCTOR CHIP USED IN THE METHOD</title><description>A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjbEKwjAURbs4iPoPD5yFtoro-HhJmqBNQvIylyJxUbRQ_x8L9QNczl3O5SyLRytZOwFOQYs2KSROwdgGENTVeCA9wSNdsJGAVgB6jwE5RWAHyIykJzfK1pCzIhG7MJ9SlAKMBdYS5si6WNz755g3v10VWyWZ9C4P7y6PQ3_Lr_zpUqzL6lCdj_WpxGr_n_UFKrE2mA</recordid><startdate>20140717</startdate><enddate>20140717</enddate><creator>PARK SANG-SICK</creator><creator>SONG HO-GEON</creator><creator>UMEMOTO MITSUO</creator><creator>JEON CHANG-SEONG</creator><scope>EVB</scope></search><sort><creationdate>20140717</creationdate><title>METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH A SEMICONDUCTOR CHIP USED IN THE METHOD</title><author>PARK SANG-SICK ; SONG HO-GEON ; UMEMOTO MITSUO ; JEON CHANG-SEONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014196280A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PARK SANG-SICK</creatorcontrib><creatorcontrib>SONG HO-GEON</creatorcontrib><creatorcontrib>UMEMOTO MITSUO</creatorcontrib><creatorcontrib>JEON CHANG-SEONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PARK SANG-SICK</au><au>SONG HO-GEON</au><au>UMEMOTO MITSUO</au><au>JEON CHANG-SEONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH A SEMICONDUCTOR CHIP USED IN THE METHOD</title><date>2014-07-17</date><risdate>2014</risdate><abstract>A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH A SEMICONDUCTOR CHIP USED IN THE METHOD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T10%3A16%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=PARK%20SANG-SICK&rft.date=2014-07-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2014196280A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true