CONTROLLED IMPEDANCE FLEX CIRCUIT

CONTROLLED IMPEDANCE FLEX CIRCUIT

A flat flexible-printed-circuit cable is provided that is designed to route high speed digital bus signals across various printed circuit boards without substantial signal attenuation. The flat flexible-printed-circuit cable can include a polyimide substrate; a first layer of copper being a solid gr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: COLMAN GERALD ADOLPH
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator COLMAN GERALD ADOLPH
description A flat flexible-printed-circuit cable is provided that is designed to route high speed digital bus signals across various printed circuit boards without substantial signal attenuation. The flat flexible-printed-circuit cable can include a polyimide substrate; a first layer of copper being a solid ground plane over the polyimide substrate; a dielectric continuous layer; a second layer of copper being a routing layer for high speed digital bus signals across various printed circuit boards; and connectors at ends of the cable having ground terminals to which the first layer contacts.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2014168926A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2014168926A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2014168926A13</originalsourceid><addsrcrecordid>eNrjZFB09vcLCfL38XF1UfD0DXB1cfRzdlVw83GNUHD2DHIO9QzhYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoYmhmYWlkZmjobGxKkCAKGmIyg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CONTROLLED IMPEDANCE FLEX CIRCUIT</title><source>esp@cenet</source><creator>COLMAN GERALD ADOLPH</creator><creatorcontrib>COLMAN GERALD ADOLPH</creatorcontrib><description>A flat flexible-printed-circuit cable is provided that is designed to route high speed digital bus signals across various printed circuit boards without substantial signal attenuation. The flat flexible-printed-circuit cable can include a polyimide substrate; a first layer of copper being a solid ground plane over the polyimide substrate; a dielectric continuous layer; a second layer of copper being a routing layer for high speed digital bus signals across various printed circuit boards; and connectors at ends of the cable having ground terminals to which the first layer contacts.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140619&amp;DB=EPODOC&amp;CC=US&amp;NR=2014168926A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140619&amp;DB=EPODOC&amp;CC=US&amp;NR=2014168926A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>COLMAN GERALD ADOLPH</creatorcontrib><title>CONTROLLED IMPEDANCE FLEX CIRCUIT</title><description>A flat flexible-printed-circuit cable is provided that is designed to route high speed digital bus signals across various printed circuit boards without substantial signal attenuation. The flat flexible-printed-circuit cable can include a polyimide substrate; a first layer of copper being a solid ground plane over the polyimide substrate; a dielectric continuous layer; a second layer of copper being a routing layer for high speed digital bus signals across various printed circuit boards; and connectors at ends of the cable having ground terminals to which the first layer contacts.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB09vcLCfL38XF1UfD0DXB1cfRzdlVw83GNUHD2DHIO9QzhYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoYmhmYWlkZmjobGxKkCAKGmIyg</recordid><startdate>20140619</startdate><enddate>20140619</enddate><creator>COLMAN GERALD ADOLPH</creator><scope>EVB</scope></search><sort><creationdate>20140619</creationdate><title>CONTROLLED IMPEDANCE FLEX CIRCUIT</title><author>COLMAN GERALD ADOLPH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014168926A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>COLMAN GERALD ADOLPH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>COLMAN GERALD ADOLPH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONTROLLED IMPEDANCE FLEX CIRCUIT</title><date>2014-06-19</date><risdate>2014</risdate><abstract>A flat flexible-printed-circuit cable is provided that is designed to route high speed digital bus signals across various printed circuit boards without substantial signal attenuation. The flat flexible-printed-circuit cable can include a polyimide substrate; a first layer of copper being a solid ground plane over the polyimide substrate; a dielectric continuous layer; a second layer of copper being a routing layer for high speed digital bus signals across various printed circuit boards; and connectors at ends of the cable having ground terminals to which the first layer contacts.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2014168926A1
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title CONTROLLED IMPEDANCE FLEX CIRCUIT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T13%3A25%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=COLMAN%20GERALD%20ADOLPH&rft.date=2014-06-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2014168926A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true