LED STRUCTURE WITH ENHANCED MIRROR REFLECTIVITY

Embodiments of the present invention are generally related to LED chips having improved overall emission by reducing the light-absorbing effects of barrier layers adjacent mirror contacts. In one embodiment, a LED chip comprises one or more LEDs, with each LED having an active region, a first contac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BERGMANN MICHAEL, DONOFRIO MATTHEW, SCHNEIDER KEVIN S, HABERERN KEVIN W, EDMOND JOHN A, HEIKMAN STEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!