INTEGRATED CIRCUITS INCLUDING INTEGRATED PASSIVE DEVICES AND METHODS OF MANUFACTURE THEREOF

Embodiments of integrated passive devices (e.g., metal insulator metal, or MIM, capacitors) and methods of their formation include depositing a composite electrode over a semiconductor substrate (e.g., on a dielectric layer above the substrate surface), and depositing an insulator layer over the com...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	REN XIAOWEI, BURGER WAYNE R
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRICITY
Online-Zugang:	Volltext bestellen
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