POWER MODULE HAVING STACKED SUBSTRATES ARRANGED TO PROVIDE TIGHTLY-COUPLED SOURCE AND RETURN CURRENT PATHS

Power modules with reduced parasitic inductances are provided. A power module includes a first substrate including a first electrically-conductive layer and a second substrate including a second electrically-conductive layer. These substrates may be stacked on each other. A scalable network of power switches may be arranged on the substrates. Power bars may be connectable to the electrically-conductive layers through electromechanical interfaces at selectable interface locations. The locations and/or type of interface may be selectable based on the arrangement of the switches. The first and second electrically-conductive layers may be disposed on mutually opposed surfaces of a dielectric layer having a thickness chosen to effect a level of coupling between respective source and return current paths provided by the electrically-conductive layers. The level of coupling may be arranged to increase the mutual inductance within the power module, which can effectively reduce the formation of parasitic inductance in the power module.