REDUCTION OF METAL FILL INSERTION TIME IN INTEGRATED CIRCUIT DESIGN PROCESS

Techniques for use in integrated circuit design systems for reducing metal fill insertion time in the integrated circuit design process. In one example, a method includes the following steps. Metal fill data associated with a given layout from a placement and routing database of an integrated circui...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: DAVIDOVIC GORAN, INDERST JUERGEN, KLEEBERGER RUPERT, PUGLIESE FULVIO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!