SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND STORAGE MEDIUM

A wafer is held horizontally and rotated by a substrate holding mechanism. An aqueous alkaline solution is supplied to a wafer by a nozzle and caused to flow from a central portion to a peripheral edge portion of the wafer, thereby etching the wafer. An amount of oxygen, which is equal to or more th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TETSUKA TOMOKI, TANAKA HIROSHI, SAKURAI HIROKI, MINAMI TERUOMI, HAGIMOTO YOSHIYA, KAWABUCHI YOSUKE, MARUYAMA HIROTAKA, SHIMOMURA SHINICHIRO, IWAMOTO HAYATO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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