METHOD OF FORMING GOLD THIN FILM AND PRINTED CIRCUIT BOARD

There is provided a method of forming a gold thin film, the method including: forming a nickel plating layer on a surface of an object through electroless nickel (Ni) plating; forming a palladium-copper mixture plating layer on the nickel plating layer through electroless plating using a palladium-c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAM HYO SEUNG, AN CHANG YONG, CHO SEONG MIN, CHUNG CHAN HWA, RYU CHANG SUP
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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