PROCESSES AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES
Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LEE ZACHARY PHILIP MUCK DARRYL W O'DELL DALE EDWARD MOORE JOHN CLEAON MCENTIRE EDWARD ENNS ARMENTROUT RODNEY SCOTT QUILLEN MICHAEL WAYNE PETERS RICHARD DALTON HOCHSTETLER SPENCER ERICH |
| description | Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2014069458A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2014069458A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2014069458A13</originalsourceid><addsrcrecordid>eNrjZHAKCPJ3dg0Odg1WcPRzUXD29w3wD_YM8fT3C1Zw8w9SCHL19Q_z9HNXCA51Cg5x9AOqVXAL8veF8IMcQ1yDeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGhiYGZpYmphaOhMXGqAPaELMk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PROCESSES AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES</title><source>esp@cenet</source><creator>LEE ZACHARY PHILIP ; MUCK DARRYL W ; O'DELL DALE EDWARD ; MOORE JOHN CLEAON ; MCENTIRE EDWARD ENNS ; ARMENTROUT RODNEY SCOTT ; QUILLEN MICHAEL WAYNE ; PETERS RICHARD DALTON ; HOCHSTETLER SPENCER ERICH</creator><creatorcontrib>LEE ZACHARY PHILIP ; MUCK DARRYL W ; O'DELL DALE EDWARD ; MOORE JOHN CLEAON ; MCENTIRE EDWARD ENNS ; ARMENTROUT RODNEY SCOTT ; QUILLEN MICHAEL WAYNE ; PETERS RICHARD DALTON ; HOCHSTETLER SPENCER ERICH</creatorcontrib><description>Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140313&DB=EPODOC&CC=US&NR=2014069458A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76517</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140313&DB=EPODOC&CC=US&NR=2014069458A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE ZACHARY PHILIP</creatorcontrib><creatorcontrib>MUCK DARRYL W</creatorcontrib><creatorcontrib>O'DELL DALE EDWARD</creatorcontrib><creatorcontrib>MOORE JOHN CLEAON</creatorcontrib><creatorcontrib>MCENTIRE EDWARD ENNS</creatorcontrib><creatorcontrib>ARMENTROUT RODNEY SCOTT</creatorcontrib><creatorcontrib>QUILLEN MICHAEL WAYNE</creatorcontrib><creatorcontrib>PETERS RICHARD DALTON</creatorcontrib><creatorcontrib>HOCHSTETLER SPENCER ERICH</creatorcontrib><title>PROCESSES AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES</title><description>Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAKCPJ3dg0Odg1WcPRzUXD29w3wD_YM8fT3C1Zw8w9SCHL19Q_z9HNXCA51Cg5x9AOqVXAL8veF8IMcQ1yDeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGhiYGZpYmphaOhMXGqAPaELMk</recordid><startdate>20140313</startdate><enddate>20140313</enddate><creator>LEE ZACHARY PHILIP</creator><creator>MUCK DARRYL W</creator><creator>O'DELL DALE EDWARD</creator><creator>MOORE JOHN CLEAON</creator><creator>MCENTIRE EDWARD ENNS</creator><creator>ARMENTROUT RODNEY SCOTT</creator><creator>QUILLEN MICHAEL WAYNE</creator><creator>PETERS RICHARD DALTON</creator><creator>HOCHSTETLER SPENCER ERICH</creator><scope>EVB</scope></search><sort><creationdate>20140313</creationdate><title>PROCESSES AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES</title><author>LEE ZACHARY PHILIP ; MUCK DARRYL W ; O'DELL DALE EDWARD ; MOORE JOHN CLEAON ; MCENTIRE EDWARD ENNS ; ARMENTROUT RODNEY SCOTT ; QUILLEN MICHAEL WAYNE ; PETERS RICHARD DALTON ; HOCHSTETLER SPENCER ERICH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014069458A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE ZACHARY PHILIP</creatorcontrib><creatorcontrib>MUCK DARRYL W</creatorcontrib><creatorcontrib>O'DELL DALE EDWARD</creatorcontrib><creatorcontrib>MOORE JOHN CLEAON</creatorcontrib><creatorcontrib>MCENTIRE EDWARD ENNS</creatorcontrib><creatorcontrib>ARMENTROUT RODNEY SCOTT</creatorcontrib><creatorcontrib>QUILLEN MICHAEL WAYNE</creatorcontrib><creatorcontrib>PETERS RICHARD DALTON</creatorcontrib><creatorcontrib>HOCHSTETLER SPENCER ERICH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE ZACHARY PHILIP</au><au>MUCK DARRYL W</au><au>O'DELL DALE EDWARD</au><au>MOORE JOHN CLEAON</au><au>MCENTIRE EDWARD ENNS</au><au>ARMENTROUT RODNEY SCOTT</au><au>QUILLEN MICHAEL WAYNE</au><au>PETERS RICHARD DALTON</au><au>HOCHSTETLER SPENCER ERICH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROCESSES AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES</title><date>2014-03-13</date><risdate>2014</risdate><abstract>Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2014069458A1 |
| source | esp@cenet |
| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | PROCESSES AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-13T07%3A29%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE%20ZACHARY%20PHILIP&rft.date=2014-03-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2014069458A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |