BONDING OF THIN LAMINA

Methods and apparatus are provided for bonding a thin lamina to a carrier. In some embodiments, a first side of the lamina is separably contacted to a support plate. A first carrier having a first side with a layer of adhesive material is contacted to the second side of the thin lamina. The lamina i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TOLLES ROBERT, ZUNIGA STEVE, BABAYAN STEVE, SUBBARAMAN VENKATESWARAN, LELAND ORION, PETERSON STEVE, GUERRERO KEENAN K. LEON
Format:	Patent
Sprache:	eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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