BONDING OF THIN LAMINA
Methods and apparatus are provided for bonding a thin lamina to a carrier. In some embodiments, a first side of the lamina is separably contacted to a support plate. A first carrier having a first side with a layer of adhesive material is contacted to the second side of the thin lamina. The lamina i...
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creator | TOLLES ROBERT ZUNIGA STEVE BABAYAN STEVE SUBBARAMAN VENKATESWARAN LELAND ORION PETERSON STEVE GUERRERO KEENAN K. LEON |
description | Methods and apparatus are provided for bonding a thin lamina to a carrier. In some embodiments, a first side of the lamina is separably contacted to a support plate. A first carrier having a first side with a layer of adhesive material is contacted to the second side of the thin lamina. The lamina is fixed to the first carrier, where the fixing includes a first application of heat and pressure to a portion of the lamina and the first carrier. The support plate is removed, and a second application of heat and pressure are applied to the lamina and the first carrier. The second application of heat and pressure promotes an adhesive bond between the lamina and the first carrier. The second application of pressure comprises moving the lamina, the first carrier and a cover sheet between a pair of rollers. |
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LEON</creatorcontrib><description>Methods and apparatus are provided for bonding a thin lamina to a carrier. In some embodiments, a first side of the lamina is separably contacted to a support plate. A first carrier having a first side with a layer of adhesive material is contacted to the second side of the thin lamina. The lamina is fixed to the first carrier, where the fixing includes a first application of heat and pressure to a portion of the lamina and the first carrier. The support plate is removed, and a second application of heat and pressure are applied to the lamina and the first carrier. The second application of heat and pressure promotes an adhesive bond between the lamina and the first carrier. The second application of pressure comprises moving the lamina, the first carrier and a cover sheet between a pair of rollers.</description><language>eng</language><subject>LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; TRANSPORTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140220&DB=EPODOC&CC=US&NR=2014048201A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140220&DB=EPODOC&CC=US&NR=2014048201A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOLLES ROBERT</creatorcontrib><creatorcontrib>ZUNIGA STEVE</creatorcontrib><creatorcontrib>BABAYAN STEVE</creatorcontrib><creatorcontrib>SUBBARAMAN VENKATESWARAN</creatorcontrib><creatorcontrib>LELAND ORION</creatorcontrib><creatorcontrib>PETERSON STEVE</creatorcontrib><creatorcontrib>GUERRERO KEENAN K. LEON</creatorcontrib><title>BONDING OF THIN LAMINA</title><description>Methods and apparatus are provided for bonding a thin lamina to a carrier. In some embodiments, a first side of the lamina is separably contacted to a support plate. A first carrier having a first side with a layer of adhesive material is contacted to the second side of the thin lamina. The lamina is fixed to the first carrier, where the fixing includes a first application of heat and pressure to a portion of the lamina and the first carrier. The support plate is removed, and a second application of heat and pressure are applied to the lamina and the first carrier. The second application of heat and pressure promotes an adhesive bond between the lamina and the first carrier. 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LEON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014048201A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TOLLES ROBERT</creatorcontrib><creatorcontrib>ZUNIGA STEVE</creatorcontrib><creatorcontrib>BABAYAN STEVE</creatorcontrib><creatorcontrib>SUBBARAMAN VENKATESWARAN</creatorcontrib><creatorcontrib>LELAND ORION</creatorcontrib><creatorcontrib>PETERSON STEVE</creatorcontrib><creatorcontrib>GUERRERO KEENAN K. LEON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TOLLES ROBERT</au><au>ZUNIGA STEVE</au><au>BABAYAN STEVE</au><au>SUBBARAMAN VENKATESWARAN</au><au>LELAND ORION</au><au>PETERSON STEVE</au><au>GUERRERO KEENAN K. LEON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BONDING OF THIN LAMINA</title><date>2014-02-20</date><risdate>2014</risdate><abstract>Methods and apparatus are provided for bonding a thin lamina to a carrier. In some embodiments, a first side of the lamina is separably contacted to a support plate. A first carrier having a first side with a layer of adhesive material is contacted to the second side of the thin lamina. The lamina is fixed to the first carrier, where the fixing includes a first application of heat and pressure to a portion of the lamina and the first carrier. The support plate is removed, and a second application of heat and pressure are applied to the lamina and the first carrier. The second application of heat and pressure promotes an adhesive bond between the lamina and the first carrier. The second application of pressure comprises moving the lamina, the first carrier and a cover sheet between a pair of rollers.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING |
title | BONDING OF THIN LAMINA |
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