BONDING OF THIN LAMINA

Methods and apparatus are provided for bonding a thin lamina to a carrier. In some embodiments, a first side of the lamina is separably contacted to a support plate. A first carrier having a first side with a layer of adhesive material is contacted to the second side of the thin lamina. The lamina i...

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Hauptverfasser: TOLLES ROBERT, ZUNIGA STEVE, BABAYAN STEVE, SUBBARAMAN VENKATESWARAN, LELAND ORION, PETERSON STEVE, GUERRERO KEENAN K. LEON
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creator TOLLES ROBERT
ZUNIGA STEVE
BABAYAN STEVE
SUBBARAMAN VENKATESWARAN
LELAND ORION
PETERSON STEVE
GUERRERO KEENAN K. LEON
description Methods and apparatus are provided for bonding a thin lamina to a carrier. In some embodiments, a first side of the lamina is separably contacted to a support plate. A first carrier having a first side with a layer of adhesive material is contacted to the second side of the thin lamina. The lamina is fixed to the first carrier, where the fixing includes a first application of heat and pressure to a portion of the lamina and the first carrier. The support plate is removed, and a second application of heat and pressure are applied to the lamina and the first carrier. The second application of heat and pressure promotes an adhesive bond between the lamina and the first carrier. The second application of pressure comprises moving the lamina, the first carrier and a cover sheet between a pair of rollers.
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subjects LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
title BONDING OF THIN LAMINA
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