LEAD-FREE SOLDER COMPOSITION FOR GLASS

LEAD-FREE SOLDER COMPOSITION FOR GLASS

The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as...

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Hauptverfasser: JEONG HAE WON, LEE SUN MYUNG, JOO HONG NHO, BAK MIN HO, KIM SEUNG KYU, PARK HYUN DAL, YOON HO JUNE, LEE JOO DONG, LEE TAE SEUNG, JUNG HYUN CHAE
Format: Patent
Sprache:eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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creator JEONG HAE WON
LEE SUN MYUNG
JOO HONG NHO
BAK MIN HO
KIM SEUNG KYU
PARK HYUN DAL
YOON HO JUNE
LEE JOO DONG
LEE TAE SEUNG
JUNG HYUN CHAE
description The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2014044589A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2014044589A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2014044589A13</originalsourceid><addsrcrecordid>eNrjZFDzcXV00XULcnVVCPb3cXENUnD29w3wD_YM8fT3U3DzD1Jw93EMDuZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhiYGJiamFpaOhsbEqQIARR4kbg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LEAD-FREE SOLDER COMPOSITION FOR GLASS</title><source>esp@cenet</source><creator>JEONG HAE WON ; LEE SUN MYUNG ; JOO HONG NHO ; BAK MIN HO ; KIM SEUNG KYU ; PARK HYUN DAL ; YOON HO JUNE ; LEE JOO DONG ; LEE TAE SEUNG ; JUNG HYUN CHAE</creator><creatorcontrib>JEONG HAE WON ; LEE SUN MYUNG ; JOO HONG NHO ; BAK MIN HO ; KIM SEUNG KYU ; PARK HYUN DAL ; YOON HO JUNE ; LEE JOO DONG ; LEE TAE SEUNG ; JUNG HYUN CHAE</creatorcontrib><description>The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.</description><language>eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140213&amp;DB=EPODOC&amp;CC=US&amp;NR=2014044589A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140213&amp;DB=EPODOC&amp;CC=US&amp;NR=2014044589A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JEONG HAE WON</creatorcontrib><creatorcontrib>LEE SUN MYUNG</creatorcontrib><creatorcontrib>JOO HONG NHO</creatorcontrib><creatorcontrib>BAK MIN HO</creatorcontrib><creatorcontrib>KIM SEUNG KYU</creatorcontrib><creatorcontrib>PARK HYUN DAL</creatorcontrib><creatorcontrib>YOON HO JUNE</creatorcontrib><creatorcontrib>LEE JOO DONG</creatorcontrib><creatorcontrib>LEE TAE SEUNG</creatorcontrib><creatorcontrib>JUNG HYUN CHAE</creatorcontrib><title>LEAD-FREE SOLDER COMPOSITION FOR GLASS</title><description>The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDzcXV00XULcnVVCPb3cXENUnD29w3wD_YM8fT3U3DzD1Jw93EMDuZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhiYGJiamFpaOhsbEqQIARR4kbg</recordid><startdate>20140213</startdate><enddate>20140213</enddate><creator>JEONG HAE WON</creator><creator>LEE SUN MYUNG</creator><creator>JOO HONG NHO</creator><creator>BAK MIN HO</creator><creator>KIM SEUNG KYU</creator><creator>PARK HYUN DAL</creator><creator>YOON HO JUNE</creator><creator>LEE JOO DONG</creator><creator>LEE TAE SEUNG</creator><creator>JUNG HYUN CHAE</creator><scope>EVB</scope></search><sort><creationdate>20140213</creationdate><title>LEAD-FREE SOLDER COMPOSITION FOR GLASS</title><author>JEONG HAE WON ; LEE SUN MYUNG ; JOO HONG NHO ; BAK MIN HO ; KIM SEUNG KYU ; PARK HYUN DAL ; YOON HO JUNE ; LEE JOO DONG ; LEE TAE SEUNG ; JUNG HYUN CHAE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014044589A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>JEONG HAE WON</creatorcontrib><creatorcontrib>LEE SUN MYUNG</creatorcontrib><creatorcontrib>JOO HONG NHO</creatorcontrib><creatorcontrib>BAK MIN HO</creatorcontrib><creatorcontrib>KIM SEUNG KYU</creatorcontrib><creatorcontrib>PARK HYUN DAL</creatorcontrib><creatorcontrib>YOON HO JUNE</creatorcontrib><creatorcontrib>LEE JOO DONG</creatorcontrib><creatorcontrib>LEE TAE SEUNG</creatorcontrib><creatorcontrib>JUNG HYUN CHAE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JEONG HAE WON</au><au>LEE SUN MYUNG</au><au>JOO HONG NHO</au><au>BAK MIN HO</au><au>KIM SEUNG KYU</au><au>PARK HYUN DAL</au><au>YOON HO JUNE</au><au>LEE JOO DONG</au><au>LEE TAE SEUNG</au><au>JUNG HYUN CHAE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LEAD-FREE SOLDER COMPOSITION FOR GLASS</title><date>2014-02-13</date><risdate>2014</risdate><abstract>The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.</abstract><oa>free_for_read</oa></addata></record>
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subjects CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title LEAD-FREE SOLDER COMPOSITION FOR GLASS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T04%3A19%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JEONG%20HAE%20WON&rft.date=2014-02-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2014044589A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true