SEMICONDUCTOR PACKAGE WITH SINGLE SIDED SUBSTRATE DESIGN AND MANUFACTURING METHODS THEREOF

A multilayer substrate includes a first outer conductive patterned layer, a first insulating layer exposing a portion of the first outer conductive patterned layer to define a first set of pads, a second outer conductive patterned layer, and a second insulating layer exposing a portion of the second...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SU YUANANG, CHEN CHIANG, HUANG SHIH-FU, LEE MING CHIANG, CHEN TZU-HUI, CHEN KUANG-HSIUNG, HSIEH PAO-MING, APPELT BERND KARL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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