CONDUCTIVE LAMINATE AND TOUCH PANEL

A conductive laminate includes a substrate, a crosslinked layer, and a conductive layer and a protective layer, wherein (i) the crosslinked layer is composed of a crosslinked polymer including a structure in which compounds, each having two or more carbon-carbon double bond groups contributing to a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: UEOKA TAKENORI, SATO YOSHIKAZU, WATANABE OSAMU, ASAI NOBUKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator UEOKA TAKENORI
SATO YOSHIKAZU
WATANABE OSAMU
ASAI NOBUKI
description A conductive laminate includes a substrate, a crosslinked layer, and a conductive layer and a protective layer, wherein (i) the crosslinked layer is composed of a crosslinked polymer including a structure in which compounds, each having two or more carbon-carbon double bond groups contributing to a polymerization reaction, are subjected to the polymerization reaction, and also the mass content of a unit structure portion of the carbon-carbon double bond group in the structure derived from the carbon-carbon double bond group is from 9 to 26% by mass relative to the total mass of the crosslinked layer; (ii) the crosslinked layer has a thickness of 50 nm to 1 mum; (iii) the conductive layer contains a conductive component having a network structure composed of linear structures; and (iv) the protective layer has an average thickness (t) of 70 nm to 1 mum.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2014008115A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2014008115A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2014008115A13</originalsourceid><addsrcrecordid>eNrjZFB29vdzCXUO8QxzVfBx9PX0cwxxVXD0c1EI8Q919lAIcPRz9eFhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhiYGBhaGhqaOhsbEqQIA1lYjbw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CONDUCTIVE LAMINATE AND TOUCH PANEL</title><source>esp@cenet</source><creator>UEOKA TAKENORI ; SATO YOSHIKAZU ; WATANABE OSAMU ; ASAI NOBUKI</creator><creatorcontrib>UEOKA TAKENORI ; SATO YOSHIKAZU ; WATANABE OSAMU ; ASAI NOBUKI</creatorcontrib><description>A conductive laminate includes a substrate, a crosslinked layer, and a conductive layer and a protective layer, wherein (i) the crosslinked layer is composed of a crosslinked polymer including a structure in which compounds, each having two or more carbon-carbon double bond groups contributing to a polymerization reaction, are subjected to the polymerization reaction, and also the mass content of a unit structure portion of the carbon-carbon double bond group in the structure derived from the carbon-carbon double bond group is from 9 to 26% by mass relative to the total mass of the crosslinked layer; (ii) the crosslinked layer has a thickness of 50 nm to 1 mum; (iii) the conductive layer contains a conductive component having a network structure composed of linear structures; and (iv) the protective layer has an average thickness (t) of 70 nm to 1 mum.</description><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140109&amp;DB=EPODOC&amp;CC=US&amp;NR=2014008115A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140109&amp;DB=EPODOC&amp;CC=US&amp;NR=2014008115A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UEOKA TAKENORI</creatorcontrib><creatorcontrib>SATO YOSHIKAZU</creatorcontrib><creatorcontrib>WATANABE OSAMU</creatorcontrib><creatorcontrib>ASAI NOBUKI</creatorcontrib><title>CONDUCTIVE LAMINATE AND TOUCH PANEL</title><description>A conductive laminate includes a substrate, a crosslinked layer, and a conductive layer and a protective layer, wherein (i) the crosslinked layer is composed of a crosslinked polymer including a structure in which compounds, each having two or more carbon-carbon double bond groups contributing to a polymerization reaction, are subjected to the polymerization reaction, and also the mass content of a unit structure portion of the carbon-carbon double bond group in the structure derived from the carbon-carbon double bond group is from 9 to 26% by mass relative to the total mass of the crosslinked layer; (ii) the crosslinked layer has a thickness of 50 nm to 1 mum; (iii) the conductive layer contains a conductive component having a network structure composed of linear structures; and (iv) the protective layer has an average thickness (t) of 70 nm to 1 mum.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB29vdzCXUO8QxzVfBx9PX0cwxxVXD0c1EI8Q919lAIcPRz9eFhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhiYGBhaGhqaOhsbEqQIA1lYjbw</recordid><startdate>20140109</startdate><enddate>20140109</enddate><creator>UEOKA TAKENORI</creator><creator>SATO YOSHIKAZU</creator><creator>WATANABE OSAMU</creator><creator>ASAI NOBUKI</creator><scope>EVB</scope></search><sort><creationdate>20140109</creationdate><title>CONDUCTIVE LAMINATE AND TOUCH PANEL</title><author>UEOKA TAKENORI ; SATO YOSHIKAZU ; WATANABE OSAMU ; ASAI NOBUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014008115A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>UEOKA TAKENORI</creatorcontrib><creatorcontrib>SATO YOSHIKAZU</creatorcontrib><creatorcontrib>WATANABE OSAMU</creatorcontrib><creatorcontrib>ASAI NOBUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UEOKA TAKENORI</au><au>SATO YOSHIKAZU</au><au>WATANABE OSAMU</au><au>ASAI NOBUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONDUCTIVE LAMINATE AND TOUCH PANEL</title><date>2014-01-09</date><risdate>2014</risdate><abstract>A conductive laminate includes a substrate, a crosslinked layer, and a conductive layer and a protective layer, wherein (i) the crosslinked layer is composed of a crosslinked polymer including a structure in which compounds, each having two or more carbon-carbon double bond groups contributing to a polymerization reaction, are subjected to the polymerization reaction, and also the mass content of a unit structure portion of the carbon-carbon double bond group in the structure derived from the carbon-carbon double bond group is from 9 to 26% by mass relative to the total mass of the crosslinked layer; (ii) the crosslinked layer has a thickness of 50 nm to 1 mum; (iii) the conductive layer contains a conductive component having a network structure composed of linear structures; and (iv) the protective layer has an average thickness (t) of 70 nm to 1 mum.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2014008115A1
source esp@cenet
subjects AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
title CONDUCTIVE LAMINATE AND TOUCH PANEL
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T14%3A39%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=UEOKA%20TAKENORI&rft.date=2014-01-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2014008115A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true