MICROELECTRONIC FLIP CHIP PACKAGES WITH SOLDER WETTING PADS AND ASSOCIATED METHODS OF MANUFACTURING

Processes of assembling microelectronic packages with lead frames and/or other suitable substrates are described herein. In one embodiment, a method for fabricating a semiconductor assembly includes forming an attachment area and a non-attachment area on a lead finger of a lead frame. The attachment...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	JIANG HUNT HANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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