Integration of Precision MIM Capacitor and Precision Thin Film Resistor

An integrated circuit with a high precision MIM capacitor and a high precision resistor with via etch stop landing pads on the resistor heads that are formed with the capacitor bottom plate material. A process of forming an integrated circuit with a high precision MIM capacitor and a high precision...

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Hauptverfasser: CAMPBELL JOHN PAUL, MURPHY NEAL THOMAS, KHAN IMRAN MAHMOOD
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creator CAMPBELL JOHN PAUL
MURPHY NEAL THOMAS
KHAN IMRAN MAHMOOD
description An integrated circuit with a high precision MIM capacitor and a high precision resistor with via etch stop landing pads on the resistor heads that are formed with the capacitor bottom plate material. A process of forming an integrated circuit with a high precision MIM capacitor and a high precision resistor where via etch stop landing pads over the resistor heads are formed using the same layer that is used to form the capacitor bottom plate.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2013341759A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2013341759A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2013341759A13</originalsourceid><addsrcrecordid>eNrjZHD3zCtJTS9KLMnMz1PIT1MIKEpNziwGcXw9fRWcEwsSkzNL8osUEvNSkORCMjLzFNwyc3IVglKLM4uBCngYWNMSc4pTeaE0N4Oym2uIs4duakF-fGox0JjUvNSS-NBgIwNDY2MTQ3NTS0dDY-JUAQDVZzQb</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Integration of Precision MIM Capacitor and Precision Thin Film Resistor</title><source>esp@cenet</source><creator>CAMPBELL JOHN PAUL ; MURPHY NEAL THOMAS ; KHAN IMRAN MAHMOOD</creator><creatorcontrib>CAMPBELL JOHN PAUL ; MURPHY NEAL THOMAS ; KHAN IMRAN MAHMOOD</creatorcontrib><description>An integrated circuit with a high precision MIM capacitor and a high precision resistor with via etch stop landing pads on the resistor heads that are formed with the capacitor bottom plate material. A process of forming an integrated circuit with a high precision MIM capacitor and a high precision resistor where via etch stop landing pads over the resistor heads are formed using the same layer that is used to form the capacitor bottom plate.</description><language>eng</language><subject>ELECTRICITY</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20131226&amp;DB=EPODOC&amp;CC=US&amp;NR=2013341759A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20131226&amp;DB=EPODOC&amp;CC=US&amp;NR=2013341759A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CAMPBELL JOHN PAUL</creatorcontrib><creatorcontrib>MURPHY NEAL THOMAS</creatorcontrib><creatorcontrib>KHAN IMRAN MAHMOOD</creatorcontrib><title>Integration of Precision MIM Capacitor and Precision Thin Film Resistor</title><description>An integrated circuit with a high precision MIM capacitor and a high precision resistor with via etch stop landing pads on the resistor heads that are formed with the capacitor bottom plate material. A process of forming an integrated circuit with a high precision MIM capacitor and a high precision resistor where via etch stop landing pads over the resistor heads are formed using the same layer that is used to form the capacitor bottom plate.</description><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD3zCtJTS9KLMnMz1PIT1MIKEpNziwGcXw9fRWcEwsSkzNL8osUEvNSkORCMjLzFNwyc3IVglKLM4uBCngYWNMSc4pTeaE0N4Oym2uIs4duakF-fGox0JjUvNSS-NBgIwNDY2MTQ3NTS0dDY-JUAQDVZzQb</recordid><startdate>20131226</startdate><enddate>20131226</enddate><creator>CAMPBELL JOHN PAUL</creator><creator>MURPHY NEAL THOMAS</creator><creator>KHAN IMRAN MAHMOOD</creator><scope>EVB</scope></search><sort><creationdate>20131226</creationdate><title>Integration of Precision MIM Capacitor and Precision Thin Film Resistor</title><author>CAMPBELL JOHN PAUL ; MURPHY NEAL THOMAS ; KHAN IMRAN MAHMOOD</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013341759A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>CAMPBELL JOHN PAUL</creatorcontrib><creatorcontrib>MURPHY NEAL THOMAS</creatorcontrib><creatorcontrib>KHAN IMRAN MAHMOOD</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CAMPBELL JOHN PAUL</au><au>MURPHY NEAL THOMAS</au><au>KHAN IMRAN MAHMOOD</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Integration of Precision MIM Capacitor and Precision Thin Film Resistor</title><date>2013-12-26</date><risdate>2013</risdate><abstract>An integrated circuit with a high precision MIM capacitor and a high precision resistor with via etch stop landing pads on the resistor heads that are formed with the capacitor bottom plate material. A process of forming an integrated circuit with a high precision MIM capacitor and a high precision resistor where via etch stop landing pads over the resistor heads are formed using the same layer that is used to form the capacitor bottom plate.</abstract><oa>free_for_read</oa></addata></record>
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title Integration of Precision MIM Capacitor and Precision Thin Film Resistor
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T00%3A50%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CAMPBELL%20JOHN%20PAUL&rft.date=2013-12-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2013341759A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true