POLISHING PAD

A polishing pad is provided with a compression elastic modulus of 0.17 MPa or more and 0.32 MPa or less produced by preparing a nonwoven fabric formed of bundles of ultrafine fibers with an average monofilament diameter of 3.0 mum or more and 8.0 mum or less, preparing a polishing pad base by impreg...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIRO KUNIYASU, MATSUZAKI YUKIHIRO, KATO HIROYASU, YANAGISAWA SATOSHI, NISHIMURA HAJIME, WADA MASAHARU
Format: Patent
Sprache:eng
Schlagworte:
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