INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF

An integrated circuit packaging system and method of manufacture thereof includes: a substrate having a top insulation layer and a top conductive layer; an inter-react layer on the substrate; an integrated circuit die on the substrate; a package body on the inter-react layer and the integrated circu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIM IL KWON, CAPARAS JOSE ALVIN, LIN YAOJIAN, KOO JUNMO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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