HEAT SINK FOR AN ELECTRONIC COMPONENT

A device for thermal management of an electronic component includes an inner shell dimensioned to house an electrical circuit and a thermally conductive metal outer shell. The metal outer shell has a thickness less than 6.3246 mm; a first closed end having a first diameter and dimensioned to support...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUNKER GARY L, DICK ROBERT E, SOXMAN BARRY E, BOYSEL DARL G, BELY JASON, WHITAKER-WEILER KELLY, MYERS GARY L, KENZEVICH EILEEN M, BUSHIK J.R, SHOUP JEFFREY, CHU EDMUND, VEGA LUIS FANOR, RAGHUNATHAN NARSIMHAN, FEDUSA ANTHONY J
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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