Method for Housing an Electronic Component in a Device Package and an Electronic Component Housed in the Device Package

Method for Housing an Electronic Component in a Device Package and an Electronic Component Housed in the Device Package

A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: GEBAUER BERNHARD, OPPERMANN KLAUS-GUENTER, FRANOSCH MARTIN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator GEBAUER BERNHARD
OPPERMANN KLAUS-GUENTER
FRANOSCH MARTIN
description A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2013292855A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2013292855A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2013292855A13</originalsourceid><addsrcrecordid>eNrjZCj3TS3JyE9RSMsvUvDILy3OzEtXSMxTcM1JTS4pys_LTFZwzs8tyM9LzStRyMxTSFRwSS3LTE5VCEhMzk5MTwWqTcGpHmReagpIW0lGKppGHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSHxpsZGBobGRpZGFq6mhoTJwqAHrbRRg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for Housing an Electronic Component in a Device Package and an Electronic Component Housed in the Device Package</title><source>esp@cenet</source><creator>GEBAUER BERNHARD ; OPPERMANN KLAUS-GUENTER ; FRANOSCH MARTIN</creator><creatorcontrib>GEBAUER BERNHARD ; OPPERMANN KLAUS-GUENTER ; FRANOSCH MARTIN</creatorcontrib><description>A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20131107&amp;DB=EPODOC&amp;CC=US&amp;NR=2013292855A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20131107&amp;DB=EPODOC&amp;CC=US&amp;NR=2013292855A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GEBAUER BERNHARD</creatorcontrib><creatorcontrib>OPPERMANN KLAUS-GUENTER</creatorcontrib><creatorcontrib>FRANOSCH MARTIN</creatorcontrib><title>Method for Housing an Electronic Component in a Device Package and an Electronic Component Housed in the Device Package</title><description>A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCj3TS3JyE9RSMsvUvDILy3OzEtXSMxTcM1JTS4pys_LTFZwzs8tyM9LzStRyMxTSFRwSS3LTE5VCEhMzk5MTwWqTcGpHmReagpIW0lGKppGHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSHxpsZGBobGRpZGFq6mhoTJwqAHrbRRg</recordid><startdate>20131107</startdate><enddate>20131107</enddate><creator>GEBAUER BERNHARD</creator><creator>OPPERMANN KLAUS-GUENTER</creator><creator>FRANOSCH MARTIN</creator><scope>EVB</scope></search><sort><creationdate>20131107</creationdate><title>Method for Housing an Electronic Component in a Device Package and an Electronic Component Housed in the Device Package</title><author>GEBAUER BERNHARD ; OPPERMANN KLAUS-GUENTER ; FRANOSCH MARTIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013292855A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>GEBAUER BERNHARD</creatorcontrib><creatorcontrib>OPPERMANN KLAUS-GUENTER</creatorcontrib><creatorcontrib>FRANOSCH MARTIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GEBAUER BERNHARD</au><au>OPPERMANN KLAUS-GUENTER</au><au>FRANOSCH MARTIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for Housing an Electronic Component in a Device Package and an Electronic Component Housed in the Device Package</title><date>2013-11-07</date><risdate>2013</risdate><abstract>A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2013292855A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for Housing an Electronic Component in a Device Package and an Electronic Component Housed in the Device Package
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T11%3A48%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GEBAUER%20BERNHARD&rft.date=2013-11-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2013292855A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true