METHOD OF MANUFACTURING A COMBINED CIRCUIT BOARD

A method of manufacturing a combined circuit board includes the following steps. First, through portions (TPs) arranged in a predetermined format are formed in a rigid substrate (RS) such that the RS is divided into a predetermined removed region (PRR1) and a predetermined reserved region (PRR2) acc...

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Bibliographische Detailangaben
Hauptverfasser:	CHEN HSU-TUNG, CHIOU SHI YU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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