ELECTRONIC ASSEMBLIES AND METHODS OF FABRICATING ELECTRONIC ASSEMBLIES
Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The metal layer defines at least a portion of an electrical circuit. The electrical insulator layer is disposed...
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| creator | SMITH GREGORY S WARD TERENCE G KORICH MARK D GROSU VICENTIU |
| description | Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The metal layer defines at least a portion of an electrical circuit. The electrical insulator layer is disposed between the heat sink and the metal layer and is directly bonded to the heat sink. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2013279119A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2013279119A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2013279119A13</originalsourceid><addsrcrecordid>eNrjZHBz9XF1Dgny9_N0VnAMDnb1dfLxdA1WcPRzUfB1DfHwdwlW8HdTcHN0CvJ0dgzx9HNXwKqBh4E1LTGnOJUXSnMzKLu5hjh76KYW5MenFhckJqfmpZbEhwYbGRgaG5lbGhpaOhoaE6cKAFvFLT0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC ASSEMBLIES AND METHODS OF FABRICATING ELECTRONIC ASSEMBLIES</title><source>esp@cenet</source><creator>SMITH GREGORY S ; WARD TERENCE G ; KORICH MARK D ; GROSU VICENTIU</creator><creatorcontrib>SMITH GREGORY S ; WARD TERENCE G ; KORICH MARK D ; GROSU VICENTIU</creatorcontrib><description>Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The metal layer defines at least a portion of an electrical circuit. The electrical insulator layer is disposed between the heat sink and the metal layer and is directly bonded to the heat sink.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PUNCHING METAL ; TRANSPORTING ; WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20131024&DB=EPODOC&CC=US&NR=2013279119A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20131024&DB=EPODOC&CC=US&NR=2013279119A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SMITH GREGORY S</creatorcontrib><creatorcontrib>WARD TERENCE G</creatorcontrib><creatorcontrib>KORICH MARK D</creatorcontrib><creatorcontrib>GROSU VICENTIU</creatorcontrib><title>ELECTRONIC ASSEMBLIES AND METHODS OF FABRICATING ELECTRONIC ASSEMBLIES</title><description>Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The metal layer defines at least a portion of an electrical circuit. The electrical insulator layer is disposed between the heat sink and the metal layer and is directly bonded to the heat sink.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PUNCHING METAL</subject><subject>TRANSPORTING</subject><subject>WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBz9XF1Dgny9_N0VnAMDnb1dfLxdA1WcPRzUfB1DfHwdwlW8HdTcHN0CvJ0dgzx9HNXwKqBh4E1LTGnOJUXSnMzKLu5hjh76KYW5MenFhckJqfmpZbEhwYbGRgaG5lbGhpaOhoaE6cKAFvFLT0</recordid><startdate>20131024</startdate><enddate>20131024</enddate><creator>SMITH GREGORY S</creator><creator>WARD TERENCE G</creator><creator>KORICH MARK D</creator><creator>GROSU VICENTIU</creator><scope>EVB</scope></search><sort><creationdate>20131024</creationdate><title>ELECTRONIC ASSEMBLIES AND METHODS OF FABRICATING ELECTRONIC ASSEMBLIES</title><author>SMITH GREGORY S ; WARD TERENCE G ; KORICH MARK D ; GROSU VICENTIU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013279119A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PUNCHING METAL</topic><topic>TRANSPORTING</topic><topic>WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</topic><toplevel>online_resources</toplevel><creatorcontrib>SMITH GREGORY S</creatorcontrib><creatorcontrib>WARD TERENCE G</creatorcontrib><creatorcontrib>KORICH MARK D</creatorcontrib><creatorcontrib>GROSU VICENTIU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SMITH GREGORY S</au><au>WARD TERENCE G</au><au>KORICH MARK D</au><au>GROSU VICENTIU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC ASSEMBLIES AND METHODS OF FABRICATING ELECTRONIC ASSEMBLIES</title><date>2013-10-24</date><risdate>2013</risdate><abstract>Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The metal layer defines at least a portion of an electrical circuit. The electrical insulator layer is disposed between the heat sink and the metal layer and is directly bonded to the heat sink.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PRINTED CIRCUITS PUNCHING METAL TRANSPORTING WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL |
| title | ELECTRONIC ASSEMBLIES AND METHODS OF FABRICATING ELECTRONIC ASSEMBLIES |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T18%3A24%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SMITH%20GREGORY%20S&rft.date=2013-10-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2013279119A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |