PRINTED CIRCUIT BOARD HAVING EMBEDDED DIES AND METHOD OF FORMING SAME

A package includes a printed circuit board (PCB) having a first side and a second side and a thickness between the first side and the second side and a stacked die including a top die mounted on a bottom die, the bottom die being at least partially embedded in the PCB. Also a method of forming a pac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SWEENEY FIFIN, GONZALEZ JASON R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!