SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Conventional surface roughening plating technology cannot always improve the adhesion between a leadframe and a plating film and it depends on the material used for surface roughening plating. Conventional surface roughening technology by etching can only be used for leadframes made of limited mater...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OKAWA KEIICHI, MOTOWAKI SIGEHISA, TAKAHASHI YASUSHI, NAKAJO TAKUYA, TAMURA MASAKI, KAJIWARA RYOICHI, HOZOUJI HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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