THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES
Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach...
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| creator | ARNOLD SHAWN X MAYO SEAN A MULLINS SCOTT P THOMA JEFFREY M KIDD DOUGLAS P PYPER DENNIS R TOJIMA KENYU |
| description | Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers. |
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In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.</description><language>eng</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130808&DB=EPODOC&CC=US&NR=2013201615A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130808&DB=EPODOC&CC=US&NR=2013201615A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ARNOLD SHAWN X</creatorcontrib><creatorcontrib>MAYO SEAN A</creatorcontrib><creatorcontrib>MULLINS SCOTT P</creatorcontrib><creatorcontrib>THOMA JEFFREY M</creatorcontrib><creatorcontrib>KIDD DOUGLAS P</creatorcontrib><creatorcontrib>PYPER DENNIS R</creatorcontrib><creatorcontrib>TOJIMA KENYU</creatorcontrib><title>THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES</title><description>Stacked arrays of components are disclosed. 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The interposer can couple signals between the components on the first and second layers.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJ8QhydVVw8fR19Qv29Pdz9FEIcAwO9gxzVfAN9Qnx1HX29w3w93P1C1EIDgkKdQ4JDXIN5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGxkBsZmjqaGhMnCoAn-Aozg</recordid><startdate>20130808</startdate><enddate>20130808</enddate><creator>ARNOLD SHAWN X</creator><creator>MAYO SEAN A</creator><creator>MULLINS SCOTT P</creator><creator>THOMA JEFFREY M</creator><creator>KIDD DOUGLAS P</creator><creator>PYPER DENNIS R</creator><creator>TOJIMA KENYU</creator><scope>EVB</scope></search><sort><creationdate>20130808</creationdate><title>THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES</title><author>ARNOLD SHAWN X ; MAYO SEAN A ; MULLINS SCOTT P ; THOMA JEFFREY M ; KIDD DOUGLAS P ; PYPER DENNIS R ; TOJIMA KENYU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013201615A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ARNOLD SHAWN X</creatorcontrib><creatorcontrib>MAYO SEAN A</creatorcontrib><creatorcontrib>MULLINS SCOTT P</creatorcontrib><creatorcontrib>THOMA JEFFREY M</creatorcontrib><creatorcontrib>KIDD DOUGLAS P</creatorcontrib><creatorcontrib>PYPER DENNIS R</creatorcontrib><creatorcontrib>TOJIMA KENYU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ARNOLD SHAWN X</au><au>MAYO SEAN A</au><au>MULLINS SCOTT P</au><au>THOMA JEFFREY M</au><au>KIDD DOUGLAS P</au><au>PYPER DENNIS R</au><au>TOJIMA KENYU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES</title><date>2013-08-08</date><risdate>2013</risdate><abstract>Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS |
| title | THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES |
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