Circuit Board, Method for Fabricating the Same and Semiconductor Package Using the Same

A circuit board is provided including a core insulation film having a thickness and including a first surface and an opposite second surface, an upper stack structure and a lower stack structure. The upper stack structure has a thickness and has an upper conductive pattern having a thickness and an...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM YONG-HOON, MYUNG BOK-SIK, KIM CHUL-WOO, KIM YOUNG-BAE, LEE HEE-SEOK, NA KYUNG-TAE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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