PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME

A method of forming a semiconductor package may include providing a first package including a first semiconductor chip mounted on a first package substrate having a via-hole and molded by a first mold layer, providing a second package including a second semiconductor chip mounted on a second package...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM HYUNOL, HAN SEUNGCHAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!