POWER MOSFET PACKAGE

A power MOSFET package includes a semiconductor substrate having opposite first and second surfaces, having a first conductivity type, and forming a drain region, a doped region extending downward from the first surface and having a second conductivity type, a source region in the doped region and h...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NI CHING-YU, CHANG SHU-MING, CHEN WEI-MING, TSAI CHIA-LUN, PERNG BAWING, WEN YING-NAN, HSIEH YUN-JUI, CHENG CHIA-MING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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